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Multi Layer Printed Circuit Board Assemblies Prototype Quick Turn

Multi Layer Printed Circuit Board Assemblies Prototype Quick Turn

Multi Layer Printed Circuit Board Assemblies Prototype Quick Turn

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS
Model Number: SYF-228

Payment & Shipping Terms:

Minimum Order Quantity: 10PCS
Price: Negotiation
Packaging Details: INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Delivery Time: 6-8 DAYS
Payment Terms: O/A,D/P,L/C,T/T,PAYPAL, WEST UNION
Supply Ability: 1 MILLION PIECES PER MONTH
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Detailed Product Description

 

Multi Layer Printed Circuit Board Assemblies Prototype Quick Turn

 

 

Characteristics:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service.

 

Details:

 

1. One of the largest and professional PCB (Printed Circuit Board) manufacturers  in China with over 500 staff and 20 years’experience.

2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,  Immersion Tin, Immersion Gold, Lead-free HASL,HAL.

3. BGA,Blind&Buried Via and Impedance Control is accepted.

4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.

5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.

6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China  with 20 years’experience.

7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.

8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA.

9. Also available for 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package.

10. SMD assembly and through-hole components insertion is accepted.

11. IC preprogramming is also accepted.

12. Available for Function verification and burn in testing.

13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .

14. Environmental conformal coating to protect finished PCBA products.

15. Providing Engineering service as end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure.

16. Functional testing,repairs and inspection of the sub-finished and finished goods.

17. High mixed with low volume order is welcomed.

18. Products before delivery should be full quality checked, striving to 100% perfect.

19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.

20. Best service with punctual delivery is always provided for our customers.

 

 

Key Specifications/Special Features 

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP,  

QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach 

chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace 

and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

 

 

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

 756 mm x 756 mm

Min. IC Pitch

 0.30 mm

Max. PCB Size

 560 mm x 650 mm

Min. PCB Thickness

 0.30 mm

Min. Chip Size

 0201 (0.6 mm X 0.3 mm)

Max. BGA Size

 74 mm X 74 mm

BGA Ball Pitch

 1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

 0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

 0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

 1 time / 5 ~ 10 Pieces

Type of Assembly

 SMT and Thru-hole

Solder Type

 Water Soluble Solder Paste,Leaded and Lead-free

Type of Service

 Turn-key,Partial Turn-key or consignment

File Formats

 Bill of Materials(BOM)

 Gerber Files

 Pick-N-Places(XYRS)

Components

 Passive Down to 0201 Size

 BGA and VF BGA

 Leadless Chip Carries/CSP

 Double Sided SMT Assembly

 BGA Repair and Reball

 Part Removal and Replacement

Component Packaging

 Cut Tape,Tube,Reels,Loose Parts

Testing Method

 X-RAY Inspection and AOI Test

Order of Quantity

 High Mixed,Low Volume Order is also welcomed

Remarks: In order to get accurate quote,the following information is required

1

Complete Data of Gerber Files for the Bare PCB Board.

2

Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage

 of components for reference.

3

Please state whether we can use alternative parts for passive components or not.

4

Assembly Drawings.

5

Functional Test Time Per Board.

6

Quality Standards Required

7

Send Us Samples (if available)

8

Date of the quote needs to be submitted

 

Note Book fields

CHARGER BOARD

INVERTER

POWER CPU

LVDS CARD

IR BOARD

LCD MOTHERBOARD

LED BOARD

RAM CARD

DATA BOARD

BATT BOARD

DVR MOTHERBOARD

USB BOARD

CARD READER

AUDIO BOARD

ISDN MODEN

PC fields

2.5 inch HDD

PC/MAC FDD

DOCKING
PORT

PORT 

REPILICATOR

PCMCIA CARD

3.5 inch HDD

SATA HDD

ADAPTER

DVD ROM

SSD

Telecom fields

DVBT.ATSC TV

GPS UNIT

CAR GPS UNIT

ADSL MODEN

3.5inch DVB-T RECEIVER

Audio & Video fields

MPEG 4 PLAYER

KVM SWITCH

E-BOOK READER

HDMI BOX

DVI BOX

Electronic Security fields

LCD TV MOTHERBOARD

DVR MOTHERBOARD

CCD BOARD

IP CAMERA

CCTV CAMERA

Health

& Medical fields

DIGITAL TEMS UNIT

EAR THERMOMETER

BLOOD GLUCOSE 

TEST METERS

BODY FAT 

MONITOR

DIGITAL BLOOD PRESSURE MONITOR

LED Application fields

LED AUTO LAMP

LED ROPE LIGHT

LED BULB

OUTDOOR

LED DISPLAY

PROJECTION LIGHTING

Test Instrument fields

OSCILLOSCOPE

POWER SUPPLY

L.C.R. METER

LOGIC 

ANALYZER

MULTIMETER

Consumer Electronics fields

SENSORS BOARD

DRIVER BOARD

USB DVIVER BOARD

BAR-CODE 

PRINTER

MP3 PLAYER

SOLAR PANEL MODULE

PEN TABLET

USB HUB

USB CARD 

READER

USB FLASH DRIVE

 

 

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
 PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2~3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1~2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

 Min.Annular Ring 

0.05mm

PTH+Panel Plating

 Hole Wall copper Thickness

≧20um

 Uniformity

≧90%

 Outer Layer

 Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

1oz~3oz

EING/Flash Gold

 Nickel Thickness

2.5um~5.0um

 Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

 Solder Mask Bridge

3mil

 Legend

 Line width/Line spacing

6/6mil

 Gold Finger

 Nickel Thickness

≧120u〞

 Gold Thickness

1~50u〞

 Hot Air Level

 Tin Thickness

100~300u〞

 Routing

 Tolerance of Dimension

±0.1mm

 Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

 Punching

 Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

 V-CUT Dimension

Min:60mm

 Angle

15°30°45°

 Remain Thickness Tolerance

±0.1mm

Beveling

Beveling Dimension

30~300mm

Test

Testing Voltage

250V

Max.Dimension

540×400mm

Impedance Control

 
    Tolerance

 

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering and Gold Finger Are Acceptable

OEM&ODM Service

Yes

 

 

 

 

Contact Details
China Pressure Gauge Products Directory

Contact Person: vchn

Tel: +8613333333330

Send your inquiry directly to us (0 / 3000)

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